Description
Product Details
Hydrocolloid Technology
COMPEED® Hydrocolloid Technology provides instant pain relief due to the cushioned layer which quickly relieves the pressure that causes the corn. The wound healing technology works from the inside out to improve moisturisation which softens the corn, helping to remove it.
Stays in place for days to help prevent further painful rubbing
Individual experience may vary.
How to use
- Clean and dry skin before use, ensuring targeted area is free of creams and oils.
- Remove the top paper, then the bottom paper, avoiding touching the adhesive side.
- Apply plaster firmly over corn ensuring the edges are well smoothed down.
- Leave in place until it starts to detach. May stay in place for up to several days. For best results, use COMPEED® until skin has completely healed.
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